1.Adjustable high/low crystallinity, high sintering activity, good electrical conductivity;
2.Narrow particle size distribution, suitable for fine line printing, especially meeting 10-12μm line width requirements;
3.Customizable surface properties to adapt to paste rheology and high-speed printing requirements;
4.Compatible with TOPCon/PERC cell main grid and fine grid silver pastes.
1.High crystallinity, monodisperse, low sintering residue, low resistance;
2.Narrow particle size distribution, suitable for fine line printing requirements;
3.Customizable surface properties to adapt to paste rheology;
4.Suitable for narrow line width and high-speed printing requirements; especially meets 10-12μm line width printing;
5.Compatible with TOPCon/PERC cell main grid and fine grid silver pastes.
1.Good dispersibility, easy to redisperse in organic carriers;
2.High powder activity, large sintering shrinkage;
3.Wide particle size distribution and sintering window;
4.Good thixotropy, suitable for narrow line width and higher aspect ratio printing requirements;
5.Customizable surface properties to adapt to paste rheology;
6.Compatible with TOPCon/PERC cell main grid and fine grid silver pastes.
1.Reasonable crystallinity and particle size distribution, easy to disperse;
2.Excellent tensile and aging tensile strength;
3.Wide sintering temperature range and sintering window;
4.Meets requirements for low silver content and high-performance products;
5.Compatible with PERC back silver and TOPCon/PERC main grid paste requirements.
