Product Center

1.High-speed printing capability with ultra-fine line stencils, compatible with mass production of 12-17μm line widths;

2.Customized fine grid pastes for non-SE and SE processes;

3.Wide sintering window, excellent EL performance at ultra-low consumption, no clouding or thimble marks;

4.Proprietary materials allow more adjustment solutions for balancing Voc and FF, fast and stable;

5.Suitable for wide sheet resistance, surface concentration, or junction depth process windows;

6.Suitable for various sintering furnaces, light injection furnaces, etc.

1.High-speed printing capability with ultra-fine line stencils, compatible with mass production of 9-16μm line widths;

2.Compatible with SE and non-SE processes, suitable for high sheet resistance, high shunt resistance, and excellent EL performance;

3.Wide process window, still excellent EL performance at ultra-low consumption;

4.Proprietary materials allow more adjustment solutions for balancing efficiency and reliability, fast and stable;

5.Suitable for various sintering furnaces, light injection furnaces, laser equipment, etc.

1.Excellent Voc and FF balancing capability for higher conversion efficiency;

2.Wide sintering window, excellent IV, EL, and reliability performance at low consumption and low temperature;

3.Compatible with multiple Poly technology routes (LP, PE, PVD, etc.), customized to match different Poly layer thicknesses or structures;

4.Compatible with two-layer film structures with or without Al₂O₃ on the back side;

5.Suitable for ultra-narrow line width printing, currently compatible with fine grid layouts above 10μm;

6.Parallel technical routes for normal and low solid content to match customer cost reduction and efficiency improvement solutions;

7.Fast drying, no powder shedding during friction before and after sintering;

8.Perfectly compatible with laser-optimized contact technology to further improve cell conversion efficiency, matching the front side and reducing EL defects